Process Equipment
Optical Inspection System
Applications: Advanced Packaging, Bump & µBump,WLCP, 2D / 3D,TSV Reveal,RDL CD and height
- Combined 2D & 3D capabilities
- High resolution optics
- Advanced Image Processing & algorithms
- Flexible software
- Multiple handling options for bare and framed wafers
- Detection of miniature passivation window cracks
- Detecting probing process issues, such as probe mark shift, probe mark area, etc.
- Advanced analysis tools, including unique 3D sensor for probe mark depth analysis
AOI solutions for Microelectronics and Packaging
- AOI solutions for Microelectronics and Packaging
- Die Placement Metrology
- Die Surface, Edge Crack Detection
- Epoxy Spread and Flow Measurement
- Au, Al, Ag, and Cu Wires to 1um Resolution
- Wedge, Ball, and Stitch Wire Bonds
- Crescent, and Tape Bonds
- SMT Components