Process Equipment
Void free solution for wide range applications
- Solder ball rework
- Under fill Flip Chip
- 3D packaging
- Optoelectronics
- Wafer coating
Automatic and Semi-Automatic dicing systems:
- 2” and 4’ spindles
- Wafer Mounter
- Spindle chiller
- Wafer cleaner
- Water recycling system
- Hub blades
- C02 Injector
Assembly and Packaging Equipment for the
Microelectronics, Semiconductor, Photonics:
- Auto Wire Bonder
- Auto Die Bonder
- Auto Die Sorter
- Encapsulation
- Dispensing
- Singulation Trim and form
- Molding
- Laser Dicing
Optical Inspection System
Applications: Advanced Packaging, Bump & µBump,WLCP, 2D / 3D,TSV Reveal,RDL CD and height
- Combined 2D & 3D capabilities
- High resolution optics
- Advanced Image Processing & algorithms
- Flexible software
- Multiple handling options for bare and framed wafers
- Detection of miniature passivation window cracks
- Detecting probing process issues, such as probe mark shift, probe mark area, etc.
- Advanced analysis tools, including unique 3D sensor for probe mark depth analysis
Excellence in surface measurement
- CoPlanarity
- Flatness
- Surface roughness
- Total thickness variation
- Transparent films and coatings
AOI solutions for Microelectronics and Packaging
- AOI solutions for Microelectronics and Packaging
- Die Placement Metrology
- Die Surface, Edge Crack Detection
- Epoxy Spread and Flow Measurement
- Au, Al, Ag, and Cu Wires to 1um Resolution
- Wedge, Ball, and Stitch Wire Bonds
- Crescent, and Tape Bonds
- SMT Components
Vacuum Oven Void less soldering
- Separate Vacuum and Process Chambers
- Process Area: up to 410 x 280 x 100mm
- Short cycle Times
- Individual Soldering Profiles
- Soldering Temp up to 400 ºC
- Integrated Pumping Unit
- Formic acid process
- Flux management
Manual and Semi Automation Wire Bonding
- Heavy wire
- Fine wire
- Ball Bonding and Wedge bonding capability (Easy Conversion)
- True vertical Z bondhead
- Auto wire feed
- Manual Die bonder
Manual and Fully Automatic Die Bonder
- Up looking camera
- Dispenser
- Stamping unit
- Auto tool changer
- Eutectic bonding
- Wafer ejector
- Auto force calibration
- Flux station
- SMD feeder
- Magazine Lifter
- Indexer
- Fully automatic and manual testing
- 1 to 6 sensor configurations
- Up to 200 kgf shear
- Up to 100 kgf pull and push
- Die shear and wire pull tester
- Built in Image Capture and Automation Camera
- Optical resolutions down to 1.5 µm
- X, Y & Z axes quick 50 mm/s movements