Process Equipment

Void free solution for wide range applications

  • Solder ball rework
  • Under fill Flip Chip
  • 3D packaging
  • Optoelectronics
  • Wafer coating

Automatic and Semi-Automatic dicing systems:

  • 2” and 4’ spindles
  • Wafer Mounter
  • Spindle chiller
  • Wafer cleaner
  • Water recycling system
  • Hub blades
  • C02 Injector

High accuracy Die Bonder / Flip Chip Bonder for
the assembly of chip and micro-optics

  • accuracy +/- 0.3 µm @ 3S
  • cycle – time < 15 sec
  • epoxy stamping and dispensing
  • eutectic bonding via diode-laser or heating plate

Assembly and Packaging Equipment for the
Microelectronics, Semiconductor, Photonics:

  • Auto Wire Bonder
  • Auto Die Bonder
  • Auto Die Sorter
  • Encapsulation
  • Dispensing
  • Singulation Trim and form
  • Molding
  • Laser Dicing

Optical Inspection System

Applications: Advanced Packaging, Bump & µBump,WLCP, 2D / 3D,TSV Reveal,RDL CD and height

  • Combined 2D & 3D capabilities
  • High resolution optics
  • Advanced Image Processing & algorithms
  • Flexible software
  • Multiple handling options for bare and framed wafers
  • Detection of miniature passivation window cracks
  • Detecting probing process issues, such as probe mark shift, probe mark area, etc.
  • Advanced analysis tools, including unique 3D sensor for probe mark depth analysis

Excellence in surface measurement

  • CoPlanarity
  • Flatness
  • Surface roughness
  • Total thickness variation
  • Transparent films and coatings

Benchtop wire bonding System

  • Exchangeable bond heads
  • Gold Ball Bonding
  • Fine Wire Wedge-Wedge Bonding
  • Deep Access Wedge Bonding
  • Heavy Wire or Ribbon Bonding
  • Deformation Limit Control
  • Digital Ultrasonic Generator
  • Pattern Recognition

AOI solutions for Microelectronics and Packaging

  • AOI solutions for Microelectronics and Packaging
  • Die Placement Metrology
  • Die Surface, Edge Crack Detection
  • Epoxy Spread and Flow Measurement
  • Au, Al, Ag, and Cu Wires to 1um Resolution
  • Wedge, Ball, and Stitch Wire Bonds
  • Crescent, and Tape Bonds
  • SMT Components

Vacuum Oven Void less soldering

  • Separate Vacuum and Process Chambers
  • Process Area: up to 410 x 280 x 100mm
  • Short cycle Times
  • Individual Soldering Profiles
  • Soldering Temp up to 400 ºC
  • Integrated Pumping Unit
  • Formic acid process
  • Flux management

Manual and Semi Automation Wire Bonding

  • Heavy wire
  • Fine wire
  • Ball Bonding and Wedge bonding capability (Easy Conversion)
  • True vertical Z bondhead
  • Auto wire feed
  • Manual Die bonder

Manual and Fully Automatic Die Bonder

  • Up looking camera
  • Dispenser
  • Stamping unit
  • Auto tool changer
  • Eutectic bonding
  • Wafer ejector
  • Auto force calibration
  • Flux station
  • SMD feeder
  • Magazine Lifter
  • Indexer
  • Fully automatic and manual testing
  • 1 to 6 sensor configurations
  • Up to 200 kgf shear
  • Up to 100 kgf pull and push
  • Die shear and wire pull tester
  • Built in Image Capture and Automation Camera
  • Optical resolutions down to 1.5 µm
  • X, Y & Z axes quick 50 mm/s movements