We have thirty years of professional experience devising solutions for your microchip and electronic packaging challenges.
The field of microelectronics is rapidly expanding and changing even faster.
Here at Electronic Packaging Solutions we’ve have been serving East Coast and Mid Atlantic customers in the back end area of semiconductor manufacturing since 1979. We specialize in solutions for wire bonding, die bonding, and package singulation. We are not just equipment providers. We have the industry knowledge and technical expertise to help resolve your most complex packaging issues and devise market-ready solutions. Our focus is helping you, our customer in overcoming these challenges including accuracy requirements, height restrictions, and material availability. We can provide a heat dissipation solution for your cell phone package or help to devise a semiconductor manufacturing package.
From consumer products like digital watches and personal gaming systems to medical electronics including pacemakers and hearing aids, microelectronics are getting smaller and smaller. With these change comes new challenges and opportunities for both manufacturers and users of wire bonding, die bonding, and singulation equipment.
The equipment sets and technologies we provide are all steps in the microchip building process that go into your everyday products.
Our targeted Solutions are focused on 3 key areas:
Microchips are built on a 300mm “wafer” with hundreds of microchips. The manufacturer needs to “singulate” each of those chips for their own specific use, meaning that the chips are diced using a saw blade or laser.
Once the chips are diced and singulated, they need to be attached to a substrate, vehicle, or motherboard. This is known as the “die attach” process.
Once attached, the microchips need to be “wire bonded” to give them a connection to the outside world to send and receive data.
Electronics Manufacturing Solutions prides itself on providing best-in-class products, product support and equipment troubleshooting in these key assembly areas as we build long term partnerships with our clients.
We can build a heat dissipation solution for your cell phone package, or devise a semiconductor manufacturing package for electronics with height restrictions.
We don’t just sell the equipment, we have the industry knowledge and technical expertise to resolve your most complex issues and devise market-ready solutions.